Title:
BONDING MATERIAL AND BONDING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/114543
Kind Code:
A1
Abstract:
Disclosed is a method for forming a bonded body using metal nanoparticles. Specifically disclosed is a paste which contains a flux component that can form a metal phase even in an inert atmosphere. A bonding material, which is capable of achieving practical bonding strength in an inert atmosphere including a nitrogen atmosphere at low temperatures without requiring the application of a pressure that has been necessary for conventional bonding materials, can be obtained using the above-described paste. The paste is configured of silver nanoparticles that have an average primary particle diameter of 1-200 nm and are covered with an organic material having 8 or less carbon atoms, a flux component that has at least two carboxyl groups, and a dispersion medium. By using the paste as a bonding material, bonding between materials becomes possible even at temperatures not higher than 300˚C.
Inventors:
ENDOH, Keiichi (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA, Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
MIYAZAWA, Akihiro (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA, Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
MIYAZAWA, Akihiro (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
Application Number:
JP2010/057293
Publication Date:
September 22, 2011
Filing Date:
April 23, 2010
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD. (14-1, Soto-Kanda 4-chome Chiyoda-k, Tokyo 21, 〒1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田四丁目１４番１号 Tokyo, 〒1010021, JP)
ENDOH, Keiichi (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA, Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田四丁目１４番１号 Tokyo, 〒1010021, JP)
ENDOH, Keiichi (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA, Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
International Classes:
B22F9/00; B22F1/00; B22F1/02; H01L21/52; H05K3/32
Attorney, Agent or Firm:
HIROKOH, Masaki (Tatsuno Nishi-Tenma Bldg, 1-6 Nishi-Tenma 3-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
Claims: