Title:
BONDING MATERIAL AND BONDING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/114543
Kind Code:
A1
Abstract:
Disclosed is a method for forming a bonded body using metal nanoparticles. Specifically disclosed is a paste which contains a flux component that can form a metal phase even in an inert atmosphere. A bonding material, which is capable of achieving practical bonding strength in an inert atmosphere including a nitrogen atmosphere at low temperatures without requiring the application of a pressure that has been necessary for conventional bonding materials, can be obtained using the above-described paste. The paste is configured of silver nanoparticles that have an average primary particle diameter of 1-200 nm and are covered with an organic material having 8 or less carbon atoms, a flux component that has at least two carboxyl groups, and a dispersion medium. By using the paste as a bonding material, bonding between materials becomes possible even at temperatures not higher than 300˚C.
Inventors:
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2010/057293
Publication Date:
September 22, 2011
Filing Date:
April 23, 2010
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
International Classes:
B22F9/00; B22F1/052; B22F1/054; B22F1/102; H01L21/52; H05K3/32
Foreign References:
JP2006095534A | 2006-04-13 | |||
JP2008161907A | 2008-07-17 | |||
JP2009120923A | 2009-06-04 | |||
JP2009104807A | 2009-05-14 | |||
JP2007077479A | 2007-03-29 | |||
JP2009267374A | 2009-11-12 | |||
JP2009279649A | 2009-12-03 | |||
JP4344001B2 | 2009-10-14 |
Other References:
MORITA ET AL.: "Development of lead-free bonding technology for high-temperature environment using silver oxide particles of micrometer size", MATERIA, vol. 49, no. 1, 2010
See also references of EP 2548678A4
See also references of EP 2548678A4
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
Hiroyuki Masaki (JP)
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Claims: