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Patent Searching and Data


Title:
BONDING MATERIAL AND BONDING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/114543
Kind Code:
A1
Abstract:
Disclosed is a method for forming a bonded body using metal nanoparticles. Specifically disclosed is a paste which contains a flux component that can form a metal phase even in an inert atmosphere. A bonding material, which is capable of achieving practical bonding strength in an inert atmosphere including a nitrogen atmosphere at low temperatures without requiring the application of a pressure that has been necessary for conventional bonding materials, can be obtained using the above-described paste. The paste is configured of silver nanoparticles that have an average primary particle diameter of 1-200 nm and are covered with an organic material having 8 or less carbon atoms, a flux component that has at least two carboxyl groups, and a dispersion medium. By using the paste as a bonding material, bonding between materials becomes possible even at temperatures not higher than 300˚C.

Inventors:
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2010/057293
Publication Date:
September 22, 2011
Filing Date:
April 23, 2010
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
International Classes:
B22F9/00; B22F1/052; B22F1/054; B22F1/102; H01L21/52; H05K3/32
Foreign References:
JP2006095534A2006-04-13
JP2008161907A2008-07-17
JP2009120923A2009-06-04
JP2009104807A2009-05-14
JP2007077479A2007-03-29
JP2009267374A2009-11-12
JP2009279649A2009-12-03
JP4344001B22009-10-14
Other References:
MORITA ET AL.: "Development of lead-free bonding technology for high-temperature environment using silver oxide particles of micrometer size", MATERIA, vol. 49, no. 1, 2010
See also references of EP 2548678A4
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
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Claims: