BONDING MATERIAL AND BONDING METHOD USING SAME - DOWA ELECTRONICS MATERIALS CO

Title:

BONDING MATERIAL AND BONDING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2018/062220

Kind Code:

A1

Abstract:

Provided is a bonding material that can be easily printed on a metal substrate such as a copper substrate, and that makes it possible, when an Si chip is bonded to the metal substrate, to prevent voids from being produced in a metal bonding layer or at the interface between the metal bonding layer and the Si chip or the copper substrate even when preliminary firing is not performed, and obtain a satisfactory bonding. Also provided is a bonding method in which the bonding material is used. A bonding material comprising a metal paste containing metal particles, a solvent, and a dispersant, wherein: the metal particles comprise first metal particles (small particles) having an average primary particle diameter of 1-40 nm, second metal particles (medium particles) having an average primary particle diameter of 41-110 nm, and third metal particles (large particles) having an average primary particle diameter of 120 nm-10 μm; the first metal particles are contained in a proportion of 1.4-49 mass%, the second metal particles are contained in a proportion of 36 mass% or less, and the third metal particles are contained in a proportion of 50-95 mass% to a total of 100 mass% of the metal particles; and the ratio of the mass of the second metal particles to the mass of the first metal particles is 14/36 or higher.

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Inventors:

ENDOH KEIICHI (JP)
KANASUGI MINAMI (JP)
FUJIMOTO HIDEYUKI (JP)
KURITA SATORU (JP)

Application Number:

PCT/JP2017/034837

Publication Date:

April 05, 2018

Filing Date:

September 27, 2017

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)

International Classes:

B22F1/00; B22F1/102

Domestic Patent References:

WO2013108408A1

2013-07-25

Foreign References:

JP2011175871A	2011-09-08
JP2016000861A	2016-01-07
JP2008161907A	2008-07-17

Other References: