Title:
BONDING MATERIAL, AND BONDING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/124263
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a bonding material having both good dispensing properties and bondability, and a bonding method using the bonding material. Provided are: a bonding material that contains silver fine particles for which the average primary particle diameter is 130 nm or less, and a crosslinked-type interparticle-distance-maintaining agent that crosslinks between the silver fine particles and maintains a gap between the silver fine particles; and a bonding method using the bonding material.
Inventors:
FUJIMOTO HIDEYUKI (JP)
ENDOH KEIICHI (JP)
HORI TATSURO (JP)
KURITA SATORU (JP)
ENDOH KEIICHI (JP)
HORI TATSURO (JP)
KURITA SATORU (JP)
Application Number:
PCT/JP2017/047171
Publication Date:
July 05, 2018
Filing Date:
December 28, 2017
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
H01B1/22; B22F1/05; B22F1/054; B22F1/102; B22F1/107; H01B1/00
Foreign References:
| JP2016000861A | 2016-01-07 | |||
| JP2011240406A | 2011-12-01 | |||
| JP2016008332A | 2016-01-18 | |||
| JP2013218836A | 2013-10-24 | |||
| JPS5824201B2 | 1983-05-19 | |||
| JP5976684B2 | 2016-08-24 |
Other References:
See also references of EP 3564969A4
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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