Title:
BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER, AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/047293
Kind Code:
A1
Abstract:
This bonding member (1) is provided with: a base material (2) that contains a low melting point metal and is formed to have a substantially spiral shape as viewed in a cross-section taken in a direction orthogonal to the longitudinal direction of said base material; and a coating film (3) that is provided in a gap formed by the base material (2) as viewed in the cross-section thereof, wherein the coating film (3) includes metal particles (5) of a high melting point metal that generates an intermetallic compound having a higher melting point than the low melting point metal, through a reaction with a molten liquid of the low melting point metal. The low melting point metal is, for example, Sn or an Sn alloy. The high melting point metal is, for example, a Cu-Ni alloy, a Cu-Mn alloy, a Cu-Cr alloy, or a Cu-Al alloy.
Inventors:
WASHIZUKA SEITARO (JP)
Application Number:
PCT/JP2016/073532
Publication Date:
March 23, 2017
Filing Date:
August 10, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B23K35/14; B23K1/00; B23K35/26; B23K35/40; C22C9/00; H05K3/34; B23K101/42
Domestic Patent References:
| WO2012066795A1 | 2012-05-24 | |||
| WO2013038816A1 | 2013-03-21 | |||
| WO2013038817A1 | 2013-03-21 |
Foreign References:
| JPS58100992A | 1983-06-15 | |||
| JP2005052856A | 2005-03-03 | |||
| JPH07299591A | 1995-11-14 | |||
| JP2009106993A | 2009-05-21 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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