Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BONDING METHOD AND ADHESIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/035791
Kind Code:
A1
Abstract:
Disclosed is an adhesive resin composition containing (a) a thermosetting resin component such as an epoxy resin, (b) a latent curing agent, (c) a photopolymerizable resin component having an unsaturated group such as an acrylic monomer, and (d) a photopolymerization initiator. This adhesive resin composition is excellent in durability and reliability, and enables to bond two articles (such as components) without causing displacement during assembling of an electronic product, optical product or the like which requires precise alignment.

Inventors:
CHEN CHUNFU (JP)
Application Number:
PCT/JP2007/068562
Publication Date:
March 27, 2008
Filing Date:
September 25, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HENKEL CORP (US)
CHEN CHUNFU (JP)
International Classes:
C09J5/00; C09J4/00; C09J4/02; C09J11/06; C09J163/00; C09J201/00
Foreign References:
JP2004131529A2004-04-30
JP2003119249A2003-04-23
Attorney, Agent or Firm:
ITO, Katsuhiro et al. (3-10-9 Nihombashi-Kayabach, Chuo-ku Tokyo, JP)
Download PDF: