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Title:
BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2011/065025
Kind Code:
A1
Abstract:
Disclosed is a bonding method which is provided with: an activation step (S2) wherein the second substrate surface of a second substrate and the first substrate surface of a first substrate are activated by irradiating the first substrate surface and the second substrate surface with particles; and a bonding step (S4) wherein the second substrate and the first substrate are bonded to each other by bringing the second substrate surface and the first substrate surface into contact with each other after the difference between the temperature of the first substrate and that of the second substrate is reduced to a prescribed value or less. In the bonding method, warpage generated in the bonded substrates thus obtained is further reduced compared with warpage generated in other bonding methods wherein a first substrate and a second substrate are bonded to each other before the difference between the temperature of the first substrate and that of the second substrate is reduced to the prescribed value or less.

Inventors:
TSUTSUMI, Keiichiro (C/O MITSUBISHI HEAVY INDUSTRIES LTD, 16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
堤 圭一郎 (〒15 東京都港区港南二丁目16番5号 三菱重工業株式会社内 Tokyo, 〒1088215, JP)
TSUNO, Takeshi (C/O MITSUBISHI HEAVY INDUSTRIES LTD, 16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
津野 武志 (〒15 東京都港区港南二丁目16番5号 三菱重工業株式会社内 Tokyo, 〒1088215, JP)
GOTO, Takayuki (C/O MITSUBISHI HEAVY INDUSTRIES LTD, 16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
後藤 崇之 (〒15 東京都港区港南二丁目16番5号 三菱重工業株式会社内 Tokyo, 〒1088215, JP)
Application Number:
JP2010/006965
Publication Date:
June 03, 2011
Filing Date:
November 30, 2010
Export Citation:
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Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (16-5, Konan 2-chome Minato-k, Tokyo 15, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目16番5号 Tokyo, 〒1088215, JP)
TSUTSUMI, Keiichiro (C/O MITSUBISHI HEAVY INDUSTRIES LTD, 16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
堤 圭一郎 (〒15 東京都港区港南二丁目16番5号 三菱重工業株式会社内 Tokyo, 〒1088215, JP)
TSUNO, Takeshi (C/O MITSUBISHI HEAVY INDUSTRIES LTD, 16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
津野 武志 (〒15 東京都港区港南二丁目16番5号 三菱重工業株式会社内 Tokyo, 〒1088215, JP)
GOTO, Takayuki (C/O MITSUBISHI HEAVY INDUSTRIES LTD, 16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
International Classes:
H01L21/02; B23K20/00; B23K20/14; B23K20/24; B23K101/40
Attorney, Agent or Firm:
OBA, Mitsuru et al. (OBA & ASSOCIATES, 8F KM Building,4-3, Iwamotocho 1-chom, Chiyoda-ku Tokyo 32, 〒1010032, JP)
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