Title:
BONDING METHOD, BONDED STRUCTURE AND BONDING KIT
Document Type and Number:
WIPO Patent Application WO/2017/082106
Kind Code:
A1
Abstract:
This bonding method comprises: a step (1) for disposing an adhesive layer on a first material to be bonded; a step (2) for disposing a curing agent layer, which is capable of curing the adhesive layer by coming into contact with and reacting with the adhesive layer, on a second material to be bonded; and a step (3) for bringing the adhesive layer and the curing agent layer into contact with each other in such a manner that the adhesive layer and the curing agent layer are sandwiched between the first material to be bonded and the second material to be bonded.
Inventors:
YOSHIDA AKIKO (JP)
OKADA KENICHI (JP)
AKAZAWA MITSUHARU (JP)
OKADA KENICHI (JP)
AKAZAWA MITSUHARU (JP)
Application Number:
PCT/JP2016/082327
Publication Date:
May 18, 2017
Filing Date:
October 31, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/04; C09J7/10; C09J11/06; C09J163/00
Foreign References:
| JPS5867775A | 1983-04-22 | |||
| JPS329886B1 | ||||
| JPH0267387A | 1990-03-07 | |||
| JPH09104082A | 1997-04-22 | |||
| JP2009167251A | 2009-07-30 |
Other References:
See also references of EP 3375833A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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