BONDING METHOD, BONDING DEVICE, COATING METHOD AND COATING DEVICE

Title:

BONDING METHOD, BONDING DEVICE, COATING METHOD AND COATING DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/021417

Kind Code:

A1

Abstract:

A substrate (40) is positioned on a stage (46), the substrate (40) and a film (41) are pressed by the stage (46) and a roller (52(1)) so that the substrate (40) and the film (41) are bonded together, and the stage (46) moves so that the entire surface of the film (41) is pressed.

Inventors:

YAMAGUCHI KATSUHIRO
NISHIOKA TADASHI

Application Number:

PCT/JP2017/027215

Publication Date:

January 31, 2019

Filing Date:

July 27, 2017

Export Citation:

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Assignee:

SHARP KK (JP)

International Classes:

B05D1/26; B29C63/02; B05D7/00; B32B37/16; H01L27/32; H01L51/50; H05B33/02; H05B33/10

Domestic Patent References:

WO2010018628A1

2010-02-18

Foreign References:

JPH0745186A	1995-02-14
JP2016179600A	2016-10-13
JP2007115560A	2007-05-10
JP2016186328A	2016-10-27
JP2016042121A	2016-03-31
JP2016078352A	2016-05-16

Attorney, Agent or Firm:

HARAKENZO WORLD PATENT & TRADEMARK (JP)

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