Title:
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/092861
Kind Code:
A1
Abstract:
Disclosed is a method for bonding a first substrate and a second substrate to each other. The method includes: a forming step for forming a protruding section in one region of the first substrate; a measuring step for measuring the position of the first substrate in a state wherein the protruding section is formed on the first substrate; and a bonding step for bonding the first substrate and the second substrate to each other by forming a contact region by bringing the protruding section of the first substrate into contact with the surface of the second substrate, and expanding the contact region.
Inventors:
MITSUISHI HAJIME (JP)
SUGAYA ISAO (JP)
FUKUDA MINORU (JP)
TSUNODA MASAKI (JP)
MAEDA HIDEHIRO (JP)
KUWANO IKUHIRO (JP)
SUGAYA ISAO (JP)
FUKUDA MINORU (JP)
TSUNODA MASAKI (JP)
MAEDA HIDEHIRO (JP)
KUWANO IKUHIRO (JP)
Application Number:
PCT/JP2017/041366
Publication Date:
May 24, 2018
Filing Date:
November 16, 2017
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
H01L21/02; H01L21/683
Domestic Patent References:
| WO2016093284A1 | 2016-06-16 |
Foreign References:
| JP2015228449A | 2015-12-17 | |||
| JP2015135909A | 2015-07-27 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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