Title:
BONDING METHOD FOR HEAT-RADIATING MEMBER AND HEAT-GENERATING ELEMENT EQUIPPED WITH HEAT-RADIATING MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/194435
Kind Code:
A1
Abstract:
According to the present invention, a heat-generating element (101), a porous metal body (102), and a metal composition (105) are prepared (preparation step). The heat-generating element (101) is, for example, a power semiconductor that generates a large amount of heat. The porous metal body (102) has a plurality of pores (80). The metal composition (105) is in paste form. The metal composition (105) includes a metal component (110) and an organic component (108). The metal component (110) comprises a Sn powder (106) and a CuNi alloy powder (107). The metal composition (105) paste is provided between the heat-generating element (101) and the porous metal body (102) (installation step). Then, the metal composition (105) is heated in accordance with a temperature profile using, for example, a reflow device (heating step).
Inventors:
WASHIZUKA SEITARO (JP)
Application Number:
PCT/JP2016/058234
Publication Date:
December 08, 2016
Filing Date:
March 16, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/40; B23K1/00; B23K1/14; B23K1/19; H01L23/36; B23K101/40; B23K103/12
Domestic Patent References:
| WO2011027659A1 | 2011-03-10 | |||
| WO2013132953A1 | 2013-09-12 |
Foreign References:
| JP2005064271A | 2005-03-10 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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