Title:
BONDING METHOD, OPTICAL MODULE MANUFACTURING METHOD, AND OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2017/029842
Kind Code:
A1
Abstract:
To achieve a bonding method whereby an angle formed between a surface of an optical element and an upper end surface of a housing side wall can accurately match a design target value. The present invention includes: a step for placing an optical element (12) on a jig (2) such that a surface (12a) is in surface contact with a first flat surface (23a) of the jig (2); and a step for placing a housing (11) on the jig (2) such that an upper end surface (11a1) of a side wall (11a) is in surface contact with a second flat surface (21a) of the jig (2), and a bottom plate (11b) is in contact with a rear surface (12b) of the optical element (12) by having an adhesive (15) therebetween.
Inventors:
IWATA KOICHIRO (JP)
Application Number:
PCT/JP2016/063895
Publication Date:
February 23, 2017
Filing Date:
May 10, 2016
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
G02B7/00; G02B26/08; G02F1/29; H01L31/02; H01S5/022
Foreign References:
| JP2011164222A | 2011-08-25 | |||
| JP2006128514A | 2006-05-18 | |||
| JP2008108992A | 2008-05-08 | |||
| JP2007206337A | 2007-08-16 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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