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Patent Searching and Data


Title:
BONDING METHOD AND PRODUCT
Document Type and Number:
WIPO Patent Application WO2003006396
Kind Code:
B1
Abstract:
The present invention relates to a method of anodic bonding a first structure (14) to a glass layer (12). The method comprises the steps of arranging a conductive pattern (11) on a substrate, providing the glass layer on said conductive pattern (11), providing said first structure on said glass layer (12), providing an electrode on one side of said first structure, and applying a voltage to said conductive pattern and said electrode to obtain an electrical field across said first structure and said glass layer, between said conductive pattern (11) and said electrode (15) produce an anodic bonding between said first structure and said glass layer.

Inventors:
BERGSTEDT LEIF (SE)
PERSSON KATRIN (SE)
Application Number:
SE0201371W
Publication Date:
April 08, 2004
Filing Date:
July 09, 2002
Export Citation:
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Assignee:
IMEGO AB
BERGSTEDT, LEIF
PERSSON, KATRIN
International Classes:
B81C1/00; H01L21/58; H05K1/03; H05K3/28; (IPC1-7): C03C27/00; H01L21/473; H05K3/00
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