Title:
BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/013651
Kind Code:
A1
Abstract:
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spacer (210) are placed and a high-frequency electric-field application step in which a high-frequency electric field is applied to the adhesive (11) for high-frequency dielectric heating to bond the adherend (120). The adherend (120) has a first surface, which includes recessed and protrudent portions, and the adhesive (11) for high-frequency dielectric heating comprises a thermoplastic resin. In the placement step, after the adherend (120) and the spacer (210) have been placed, there are spaces (31) formed between the first surface of the adherend (120) and the surface of the spacer (210) which faces the first surface, and the spaces (31) are filled by a deformation of the spacer (210).
Inventors:
TAYA NAOKI (JP)
AMANO YASUYUKI (JP)
AMANO YASUYUKI (JP)
Application Number:
PCT/JP2022/029692
Publication Date:
February 09, 2023
Filing Date:
August 02, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J5/06; B29C65/04; B29C65/40; C09J11/04; C09J201/00
Domestic Patent References:
| WO2018186297A1 | 2018-10-11 |
Foreign References:
| JP2004222990A | 2004-08-12 | |||
| JPS57148619A | 1982-09-14 | |||
| JP2014037489A | 2014-02-27 | |||
| JPH08267586A | 1996-10-15 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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