Title:
BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/063211
Kind Code:
A1
Abstract:
A bonding method according to the present invention is for bonding a bush to a bonding member and comprises: an adhesive applying step of applying an adhesive to the portion of a cushioning member to be bonded to the bonding member; a first heating step of heating the portion of the bonding member to be bonded to the cushioning member; a second heating step of heating the portion of the bonding member to be bonded to the cushioning member after the first heating step; and a fitting step of fitting the cushioning member to the bonding member after the second heating step.
Inventors:
MIZUTA HIDETOSHI (JP)
FURUSE ATOM (JP)
NAGASAWA KAORU (JP)
ARAI FUMITAKA (JP)
FURUSE ATOM (JP)
NAGASAWA KAORU (JP)
ARAI FUMITAKA (JP)
Application Number:
PCT/JP2022/037448
Publication Date:
April 20, 2023
Filing Date:
October 06, 2022
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
B60G21/055; C09J5/06; C09J201/00
Foreign References:
| JP2018087010A | 2018-06-07 | |||
| JP2018034666A | 2018-03-08 | |||
| JP2016084072A | 2016-05-19 | |||
| JP2006290313A | 2006-10-26 | |||
| JP6542516B2 | 2019-07-10 | |||
| JP6832312B2 | 2021-02-24 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF:
Previous Patent: GLAND PACKING
Next Patent: INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING PROGRAM
Next Patent: INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING PROGRAM