Title:
BONDING FOR A MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND MEMS BASED DEVICES
Document Type and Number:
WIPO Patent Application WO2003072487
Kind Code:
A3
Abstract:
A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chromium is first deposited onto surfaces of the micro-machine and the micro-machine chip followed by a layer of gold. Subsequently, a layer of indium is deposited between the layers of gold, and the surface of the micro-machine is pressed against the surface of the micro machine chip forming a gold-indium alloy to serve as a bond between the micro-machine and the micro-machine chip. In addition, a cover is bonded to the micro-machine chip in the same manner providing a hermetic seal for the MEMS based device.
Inventors:
PLATT WILLIAM P
FORD CAROL M
FORD CAROL M
Application Number:
PCT/US2003/005586
Publication Date:
April 15, 2004
Filing Date:
February 25, 2003
Export Citation:
Assignee:
HONEYWELL INT INC (US)
International Classes:
B81B7/00; (IPC1-7): B81B7/00; B23K20/02; B23K35/00; B23K35/02; B23K35/30
Domestic Patent References:
| WO1996019314A1 | 1996-06-27 |
Foreign References:
| EP0981159A1 | 2000-02-23 | |||
| EP0905480A2 | 1999-03-31 | |||
| US4895291A | 1990-01-23 |
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