Title:
BONDING SHEET AND PROCESS FOR MANUFACTURING SAME, AND HEAT DISSIPATING SYSTEM AND PRODUCTION PROCESS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/203547
Kind Code:
A1
Abstract:
This process for manufacturing a bonding sheet includes: forming multiple CNTs (14) which stand on a substrate (11) in an aligned state; forming a sheet-shaped support film (15) which covers the upper ends of the CNTs (14); filling a metal (17) into the spaces which are each present between adjacent CNTs (14); and thus forming a CNT-metal composite structure. According to this constitution, a highly reliable bonding sheet which exhibits excellent heat dissipation efficiency, a process for manufacturing the same, a heat dissipating system, and a production process therefor can be achieved.
Inventors:
KAWABATA AKIO (JP)
Application Number:
PCT/JP2014/051518
Publication Date:
December 24, 2014
Filing Date:
January 24, 2014
Export Citation:
Assignee:
NAT INST OF ADVANCED IND SCIEN (JP)
International Classes:
H01L23/373; B82Y30/00; B82Y40/00; C01B31/02
Domestic Patent References:
| WO2013046291A1 | 2013-04-04 |
Foreign References:
| JP2009260238A | 2009-11-05 | |||
| JP2008137846A | 2008-06-19 | |||
| JP3159198U | 2010-05-13 | |||
| JP2010278440A | 2010-12-09 | |||
| JP2009130113A | 2009-06-11 |
Attorney, Agent or Firm:
KOKUBUN, Takayoshi (JP)
Takayoshi Kokubu (JP)
Takayoshi Kokubu (JP)
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