Title:
BONDING SHEET
Document Type and Number:
WIPO Patent Application WO/2010/131655
Kind Code:
A1
Abstract:
Disclosed is a bonding sheet which comprises an adhesive layer that is obtained by shaping an adhesive composition, which contains (A) a high molecular weight component and (B) a thermosetting component, into a sheet-like form. The bonding sheet is characterized in that the ratio of the peak height (PCN) around 2,240 cm-1 assigned to the nitrile group relative to the peak height (PCO) around 1,730 cm-1 assigned to the carbonyl group, namely PCN/PCO is not more than 0.03 in the IR spectrum of (A) the high molecular weight component.
Inventors:
KODAMA MEGUMI (JP)
TOKUYASU TAKAHIRO (JP)
IWAKURA TETSUROU (JP)
TOKUYASU TAKAHIRO (JP)
IWAKURA TETSUROU (JP)
Application Number:
PCT/JP2010/057965
Publication Date:
November 18, 2010
Filing Date:
May 11, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KODAMA MEGUMI (JP)
TOKUYASU TAKAHIRO (JP)
IWAKURA TETSUROU (JP)
KODAMA MEGUMI (JP)
TOKUYASU TAKAHIRO (JP)
IWAKURA TETSUROU (JP)
International Classes:
C09J7/02; C09J11/04; C09J11/06; C09J201/00; H01L21/52
Domestic Patent References:
| WO2005103180A1 | 2005-11-03 |
Foreign References:
| JP2006022194A | 2006-01-26 | |||
| JP2002275444A | 2002-09-25 | |||
| JP2002121525A | 2002-04-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims:
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