BONDING SHEET - MITSUBISHI MATERIALS CORP

Title:

BONDING SHEET

Document Type and Number:

WIPO Patent Application WO/2021/153560

Kind Code:

A1

Abstract:

Provided is a bonding sheet which uses copper particles, and with which it is possible to: mitigate a decrease in sintering ability due to oxidation of the copper particles; form a bonding layer that is minutely formed and has few voids; and join electronic components and the like at a high bonding strength. A bonding sheet (1) comprises: copper particles (2); and a solvent (3) with a boiling point of 150°C or greater. The copper particles (2) are formed such that the surface thereof is coated with an organic protective film, the ratio of the copper particles (2) to the solvent (3) contained in the bonding sheet is 99:1 to 90:10 by mass, and the BET diameter of the copper particles (2) is in the range of 50 nm to 300 nm, inclusive.

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Inventors:

MASUYAMA KOTARO (JP)
OTOGAWA KOHEI (JP)
YAMAGUCHI TOMOHIKO (JP)
NAKAYA KIYOTAKA (JP)

Application Number:

PCT/JP2021/002645

Publication Date:

August 05, 2021

Filing Date:

January 26, 2021

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

B22F1/00; B22F1/102; B22F7/08; H01B1/00; H01B1/22

Domestic Patent References:

WO2018131095A1

2018-07-19

Foreign References:

JP2016014181A	2016-01-28
JP2010138494A	2010-06-24
JP2014167145A	2014-09-11
JP2018003088A	2018-01-11

Attorney, Agent or Firm:

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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