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Title:
BONDING SHEET
Document Type and Number:
WIPO Patent Application WO/2022/191110
Kind Code:
A1
Abstract:
A bonding sheet according to the present invention contains a matrix resin, solder particles and a flux agent. This bonding sheet has a surface that has a surface roughness Sa of 2.5 μm or less.

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Inventors:
NITTA AYUMI (JP)
KATO MASATOSHI (JP)
KOSAKA NAOFUMI (JP)
Application Number:
PCT/JP2022/009646
Publication Date:
September 15, 2022
Filing Date:
March 07, 2022
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01R11/01; B23K1/00; B23K35/14; B23K35/26; B23K35/363; B23K35/40; C08K3/08; C08K5/09; C08L101/00; C09J7/35; C09J9/02; C09J11/04; C09J11/06; C09J201/00; C22C12/00
Foreign References:
JP2021002446A2021-01-07
JP2015044912A2015-03-12
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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