Title:
BONDING STRUCTURE, FLEXIBLE PANEL WITH BONDING STRUCTURE AND FABRICATING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/128855
Kind Code:
A1
Abstract:
A flexible panel bonding structure and a fabricating method therefor. The flexible panel bonding structure is provided with a flexible panel and a chip (20) mounted on a surface of the flexible panel. A bonding area (11) for bonding the chip is arranged on the flexible panel. A flexible protection layer (30) is coated within the bonding area (11). The flexible protection layer (30) surrounds the periphery of the chip (20). Compared with the prior art, by means of forming, around the periphery of the chip (20), flexible protection layers (30) of different stiffness, the stresses generated around the periphery the chip (20) while stripping are greatly dispersed, thereby forming trapezoid stresses, avoiding generating stress concentration at a position closely adjacent to the periphery of the chip (20), reducing the risk of breaking a circuit around the chip (20), and finally improving the stripping yield rate of the flexible panel.
Inventors:
ZHANG XIUYU (CN)
WANG BAOYOU (CN)
DANG PENGLE (CN)
DING LIWEI (CN)
ZHANG XIAOBAO (CN)
ZHU HUI (CN)
WANG BAOYOU (CN)
DANG PENGLE (CN)
DING LIWEI (CN)
ZHANG XIAOBAO (CN)
ZHU HUI (CN)
Application Number:
PCT/CN2016/108072
Publication Date:
August 03, 2017
Filing Date:
November 30, 2016
Export Citation:
Assignee:
KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CT CO LTD (CN)
International Classes:
H01L21/77; H01L27/12
Foreign References:
| CN102889487A | 2013-01-23 | |||
| JP2006237466A | 2006-09-07 | |||
| KR20130024097A | 2013-03-08 | |||
| CN202153541U | 2012-02-29 | |||
| CN203748111U | 2014-07-30 |
Other References:
See also references of EP 3382759A4
Attorney, Agent or Firm:
CO-HORIZON INTELLECTUAL PROPERTY INC. (CN)
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