Title:
BONDING SYSTEM AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/044579
Kind Code:
A1
Abstract:
This chip bonding system comprises: an activation processing device (60) having a frame holding part (621), and a particle beam source (61) that activates a bonding surface (CPf) of a chip (CP) by irradiating a sheet (TE) to which the chip (CP) is adhered and which is held by the frame holding part (621) with a particle beam; and a bonding device that bonds the chip (CP) having the bonding surface (CPf) activated by the activation processing device (60) to a substrate by bringing the chip into contact with the substrate. The frame holding part (621) supports a holding frame (112) that is made from resin and that holds the sheet TE on which the chip (CP) is adhered, the frame holding part supporting the holding frame in an orientation where one surface side of the sheet (TE) held by the holding frame (112), the sheet having the chip (CP) adhered thereon, is exposed to the particle beam source (61) side.
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Inventors:
SUGA TADATOMO (JP)
YAMAUCHI AKIRA (JP)
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2018/042182
Publication Date:
March 05, 2020
Filing Date:
November 14, 2018
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
SUGA TADATOMO (JP)
SUGA TADATOMO (JP)
International Classes:
H01L21/02; H01L21/60
Domestic Patent References:
| WO2018147147A1 | 2018-08-16 |
Foreign References:
| JP2014113633A | 2014-06-26 | |||
| JP2018133497A | 2018-08-23 | |||
| JP2013243333A | 2013-12-05 | |||
| JP2017079316A | 2017-04-27 | |||
| JP2018056507A | 2018-04-05 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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