Title:
BONDING WIRE FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/158895
Kind Code:
A1
Abstract:
The present invention relates to a bonding wire for a semiconductor package, wherein an insulating film is formed on the outer surface of a core part by means of a thin-film deposition method, so that the occurrence of a short-circuit during wire bonding is fundamentally prevented and bonding characteristics are improved. The bonding wire for a semiconductor package according to the present invention comprises: a core part formed of a conductive metal; and an insulating film formed on the outer surface of the core part by means of a thin-film deposition method.
Inventors:
SHIN WOONG CHUL (KR)
BAEK MIN (KR)
BAEK MIN (KR)
Application Number:
PCT/KR2022/001108
Publication Date:
July 28, 2022
Filing Date:
January 21, 2022
Export Citation:
Assignee:
SHIN WOONG CHUL (KR)
BAEK MIN (KR)
BAEK MIN (KR)
International Classes:
H01L23/00; H01B1/02; H01B3/10
Foreign References:
| KR20160034478A | 2016-03-30 | |||
| KR101943223B1 | 2019-01-28 | |||
| KR100817076B1 | 2008-03-26 | |||
| KR20140112602A | 2014-09-24 | |||
| JP2010040944A | 2010-02-18 |
Attorney, Agent or Firm:
KIM, Ha Gi (KR)
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