Title:
BONDING WIRE FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/215951
Kind Code:
A1
Abstract:
The present invention relates to a bonding wire for a semiconductor package, wherein a buffer layer and an insulation film are formed on the outer surface of a core part by a thin-film deposition method, to thereby fundamentally prevent the occurrence of a short-circuit during wire bonding and improve bonding characteristics. The bonding wire for a semiconductor package, according to the present invention, comprises: the core part formed of conductive metal; the buffer layer formed on the outer surface of the core part by the thin-film deposition method; and the insulating film formed on the outer surface of the buffer layer by the thin-film deposition method.
Inventors:
BAEK MIN (KR)
SHIN WOONG CHUL (KR)
SHIN WOONG CHUL (KR)
Application Number:
PCT/KR2022/004625
Publication Date:
October 13, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
BAEK MIN (KR)
SHIN WOONG CHUL (KR)
SHIN WOONG CHUL (KR)
International Classes:
H01L23/00
Foreign References:
| JP2010040944A | 2010-02-18 | |||
| KR101943223B1 | 2019-01-28 | |||
| JPS63304507A | 1988-12-12 | |||
| KR20070064841A | 2007-06-22 | |||
| KR101812943B1 | 2017-12-28 |
Attorney, Agent or Firm:
KIM, Ha Gi (KR)
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