BONDING WIRE - NIPPON MICROMETAL CORP

Title:

BONDING WIRE

Document Type and Number:

WIPO Patent Application WO/2020/184654

Kind Code:

A1

Abstract:

Provided is a metal-coated Al bonding wire with which sufficient bond reliability can be obtained at bonding wire bond portions in high temperature states at which a semiconductor device using the metal-coated Al bonding wire is operated. The bonding wire is characterized in that: the bonding wire comprises a core wire that is formed from Al or an Al alloy, and a coating layer that is formed in the periphery of the core wire and formed from Ag, Au or an alloy containing Ag and Au; and a crystal orientation <111> angled at 15° or less with respect to the longitudinal direction of the wire makes up a proportion of 30-90% of crystal orientations in a core material cross section in the direction perpendicular to the wire axis. The surface roughness of the wire is preferably 2μm or less in terms of Rz.

More Like This:

JPH0245943	WIRE-BONDING METHOD AND WIRE-BONDING DEVICE
JPS5219970	SEMICONDUCTOR LEAD FRAME MANUFACTURING PROCESS
JP2010062328	SEMICONDUCTOR DEVICE

Inventors:

YAMADA TAKASHI (JP)
NISHIBAYASHI AKIHITO (JP)
HAIBARA TERUO (JP)
ODA DAIZO (JP)
ETO MOTOKI (JP)
OYAMADA TETSUYA (JP)
KOBAYASHI TAKAYUKI (JP)
UNO TOMOHIRO (JP)

Application Number:

PCT/JP2020/010761

Publication Date:

September 17, 2020

Filing Date:

March 12, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NIPPON MICROMETAL CORP (JP)
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)

International Classes:

H01L21/60

Domestic Patent References:

WO2016091718A1

2016-06-16

Foreign References:

JP2008218994A	2008-09-18
JP2014053610A	2014-03-20
JP2009158931A	2009-07-16
JP2007123597A	2007-05-17
JP2002314038A	2002-10-25
JPH08241907A	1996-09-17
JP2014082369A	2014-05-08

Other References: