BORING DEVICE FOR INCREASED-DIAMETER HOLE SECTION

WIPO Patent Application WO/2018/008645

A1

A boring device for forming an increased-diameter section at the bottom of a mounting hole comprises: a shaft provided with a contact surface which is provided at the front end thereof and which comes into contact with the bottom of the mounting hole, the shaft being also provided with a tapered surface which is provided on the side surface of the front end of the shaft and which has a diameter increasing toward the contact surface; and a cutter provided with a stopper which is provided on the side surface thereof and which comes into contact with the surface of an object being bored, the cutter being also provided with a cutting edge formed at the front end thereof, the cutter being fitted in the shaft so as to be slidable forward and backward, the cutter being configured such that, when the cutter slides forward, the cutting edge comes into contact with the tapered surface and protrudes laterally relative to the tapered surface. The cutter is provided movable between a first position where, while the contact surface is in contact with the bottom of the mounting hole, the stopper is located at a distance from the surface of the object being bored, and a second position to which the cutter is moved by being pushed forward from the first position, causing the cutting edge to protrude laterally relative to the tapered surface and the stopper to come into contact with the surface of the object being bored.

MIYANAGA MASAAKI

PCT/JP2017/024530

January 11, 2018

July 04, 2017

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KK MIYANAGA (JP)

B23B41/00; B28D1/14; E21B10/32

WO2007055353A1

2007-05-18

JPH032491A	1991-01-08
JPH02184409A	1990-07-18
US4446934A	1984-05-08

See also references of EP 3482898A4

PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)

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