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Title:
BORING DEVICE FOR INCREASED-DIAMETER HOLE SECTION
Document Type and Number:
WIPO Patent Application WO/2018/008645
Kind Code:
A1
Abstract:
A boring device for forming an increased-diameter section at the bottom of a mounting hole comprises: a shaft provided with a contact surface which is provided at the front end thereof and which comes into contact with the bottom of the mounting hole, the shaft being also provided with a tapered surface which is provided on the side surface of the front end of the shaft and which has a diameter increasing toward the contact surface; and a cutter provided with a stopper which is provided on the side surface thereof and which comes into contact with the surface of an object being bored, the cutter being also provided with a cutting edge formed at the front end thereof, the cutter being fitted in the shaft so as to be slidable forward and backward, the cutter being configured such that, when the cutter slides forward, the cutting edge comes into contact with the tapered surface and protrudes laterally relative to the tapered surface. The cutter is provided movable between a first position where, while the contact surface is in contact with the bottom of the mounting hole, the stopper is located at a distance from the surface of the object being bored, and a second position to which the cutter is moved by being pushed forward from the first position, causing the cutting edge to protrude laterally relative to the tapered surface and the stopper to come into contact with the surface of the object being bored.

Inventors:
MIYANAGA, Masaaki
Application Number:
JP2017/024530
Publication Date:
January 11, 2018
Filing Date:
July 04, 2017
Export Citation:
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Assignee:
KABUSHIKI KAISHA MIYANAGA (2393, Fukui Miki-sh, Hyogo 33, 〒6730433, JP)
International Classes:
B28D1/14; B23B41/00; E21B10/32
Domestic Patent References:
2007-05-18
Foreign References:
JPH032491A1991-01-08
JPH02184409A1990-07-18
US4446934A1984-05-08
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (3rd Fl, Bo-eki Bldg. 123-1, Higashimachi, Chuo-ku, Kobe-sh, Hyogo 31, 〒6500031, JP)
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