Title:
BORING DEVICE AND METHOD FOR USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/095580
Kind Code:
A1
Abstract:
A boring device that forms a through-hole, for each well, in a seal member that is affixed to a microplate (1) having a plurality of wells to seal the wells is provided with a boring jig (10) and a remover jig (30). The boring jig (10) includes: a flat part (11) disposed opposite an upper surface (2) of the microplate (1) on the seal member side; and a plurality of protrusion parts (12) protruding from the flat part (11) and having needle-shaped tip ends. The remover jig (30) includes: a plate-shaped push-up surface part (33a) disposed between the upper surface (2) of the microplate (1) and the flat part (11) of the boring jig (10); and an operation surface part (33b) disposed continuously with the push-up surface part (33a) and protruding further outwardly than the microplate (1). Due to a pressing force input to the operation surface part (33b), the push-up surface part (33a) causes the boring jig (10) to be separated from the microplate (1).
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Inventors:
YOSHINAGA CHIKASHI (JP)
Application Number:
PCT/JP2019/038902
Publication Date:
May 14, 2020
Filing Date:
October 02, 2019
Export Citation:
Assignee:
HIRAYAMA MFG CORPORATION (JP)
International Classes:
B67B7/52; B26D3/00; B26F1/24
Foreign References:
JPH09103997A | 1997-04-22 | |||
JP2016173259A | 2016-09-29 | |||
JP2017019028A | 2017-01-26 | |||
US20050226786A1 | 2005-10-13 | |||
JP2019123039A | 2019-07-25 |
Attorney, Agent or Firm:
SANADA, Tamotsu (JP)
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