Title:
BORING METHOD, PRODUCTION METHOD OF SUBSTRATE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2008/004307
Kind Code:
A1
Abstract:
A method for boring a workpiece by irradiating it with a light beam comprises a
step for superposing a dummy plate on the workpiece through an interposition
material, a step for irradiating the workpiece on which the dummy plate is superposed
with a light beam for boring, and a step for removing the dummy plate and the interposition
material from the workpiece irradiated with a light beam. Since chipping and
flaking in the vicinity of the bore do not occur in the workpiece but occurs in the
dummy plate, and welding of the dummy plate and the workpiece can be avoided by
the interposition material, it is possible to prevent a disadvantage that the
profile of the bore in the workpiece is damaged when the dummy plate is removed.
Inventors:
TOKURA, Fumihiko (1-1 Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-sh, Kanagawa 88, 2118588, JP)
Application Number:
JP2006/313600
Publication Date:
January 10, 2008
Filing Date:
July 07, 2006
Export Citation:
Assignee:
FUJITSU LIMITED (1-1 Kamikodanaka 4-chome, Nakahara-ku Kawasaki-sh, Kanagawa 88, 2118588, JP)
富士通株式会社 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 Kanagawa, 2118588, JP)
富士通株式会社 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 Kanagawa, 2118588, JP)
International Classes:
B23K26/38; B23K26/42; B28D5/00; B23K26/00; B28D5/00
Attorney, Agent or Firm:
YAMADA, Masaki et al. (Pelican Building 4th Floor3-3, Nishi-shimbashi 3-chomeMinato-ku, Tokyo03, Tokyo1050003, JP)
Download PDF:
Previous Patent: HYDROSTATIC LINER GUIDE UNIT
Next Patent: TRANSMITTER APPARATUS, RECEIVER APPARATUS, TRANSMITTING METHOD AND RECEIVING METHOD
Next Patent: TRANSMITTER APPARATUS, RECEIVER APPARATUS, TRANSMITTING METHOD AND RECEIVING METHOD