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Patent Searching and Data


Title:
BORING METHOD, PRODUCTION METHOD OF SUBSTRATE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2008/004307
Kind Code:
A1
Abstract:
A method for boring a workpiece by irradiating it with a light beam comprises a step for superposing a dummy plate on the workpiece through an interposition material, a step for irradiating the workpiece on which the dummy plate is superposed with a light beam for boring, and a step for removing the dummy plate and the interposition material from the workpiece irradiated with a light beam. Since chipping and flaking in the vicinity of the bore do not occur in the workpiece but occurs in the dummy plate, and welding of the dummy plate and the workpiece can be avoided by the interposition material, it is possible to prevent a disadvantage that the profile of the bore in the workpiece is damaged when the dummy plate is removed.

Inventors:
TOKURA FUMIHIKO (JP)
Application Number:
PCT/JP2006/313600
Publication Date:
January 10, 2008
Filing Date:
July 07, 2006
Export Citation:
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Assignee:
FUJITSU LTD (JP)
TOKURA FUMIHIKO (JP)
International Classes:
B23K26/38; B23K26/42; B28D5/00
Foreign References:
JPH06170822A1994-06-21
JPH10217485A1998-08-18
JP2001237548A2001-08-31
JP2002240294A2002-08-28
JP2004104079A2004-04-02
JPH10286968A1998-10-27
Attorney, Agent or Firm:
YAMADA, Masaki et al. (Nishi-shimbashi 3-chomeMinato-ku, Tokyo03, JP)
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