BOTTOM ASSEMBLY OF BLENDER CUP - ZHEJIANG DAWEI ELECTRONIC CO LTD

Title:

BOTTOM ASSEMBLY OF BLENDER CUP

Document Type and Number:

WIPO Patent Application WO/2020/238109

Kind Code:

A1

Abstract:

A bottom assembly of a blender cup, comprising a heating plate body (1) and a bottom housing (2) provided below the heating plate body (1). The heating plate body (1) and the bottom housing (2) are connected to form an accommodating cavity therebetween. A first coupler (31) is provided within the accommodating cavity. A second coupler (32) coupled and connected with the first coupler (31) is integrally injection molded at the lower end of the housing (2). A sealing ring (4) is provided at where the heating plate body (1) is connected to the periphery of the bottom housing (2). The bottom assembly of the blender cup is structurally simple, convenient to assemble, and provided with improved waterproof performance.

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Inventors:

ZHAO HAIJIE (CN)
PAN COLIN (CN)
ZHOU TAO (CN)

Application Number:

PCT/CN2019/121892

Publication Date:

December 03, 2020

Filing Date:

November 29, 2019

Export Citation:

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Assignee:

ZHEJIANG DAWEI ELECTRONIC CO LTD (CN)

International Classes:

A47J43/07; A47J43/046

Foreign References:

CN208463807U	2019-02-05
CN208889895U	2019-05-21
CN208176503U	2018-12-04
CN108463149A	2018-08-28
CN206576730U	2017-10-24
KR101216942B1	2012-12-28

Attorney, Agent or Firm:

WENZHOU OUYUE PATENT AGENTS CO., LTD (CN)

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