Title:
BOTTOM ELECTRODE MECHANISM, SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/230728
Kind Code:
A1
Abstract:
This bottom electrode mechanism is used for plasma processing and has: a base portion to which high-frequency power is applied when the plasma processing is performed; a dielectric body portion disposed on the upper surface of the base portion; and an induction heating mechanism. The induction heating mechanism comprises: an induction heating element heated by an induced magnetic field; and a magnetic field generation portion provided inside the base portion and generating the induced magnetic field.
Inventors:
MATSUMOTO NAOKI (JP)
OHATA MITSUNORI (JP)
MASUYAMA MASATAKA (JP)
MIHARA NAOKI (JP)
OHATA MITSUNORI (JP)
MASUYAMA MASATAKA (JP)
MIHARA NAOKI (JP)
Application Number:
PCT/JP2022/018219
Publication Date:
November 03, 2022
Filing Date:
April 19, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H02N13/00; C23C16/46; C23C16/505; H01L21/205; H01L21/3065; H01L21/683
Domestic Patent References:
WO2009011015A1 | 2009-01-22 | |||
WO2019171948A1 | 2019-09-12 |
Foreign References:
JP2018186179A | 2018-11-22 | |||
JP2010232476A | 2010-10-14 | |||
US20100059182A1 | 2010-03-11 | |||
JP2013185760A | 2013-09-19 | |||
JP2007335709A | 2007-12-27 | |||
JP2009238375A | 2009-10-15 | |||
JP2004221138A | 2004-08-05 | |||
US20120148760A1 | 2012-06-14 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF:
Previous Patent: MOVING IMAGE RECEIVING DEVICE, CONTROL METHOD, AND PROGRAM
Next Patent: SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
Next Patent: SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD