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Title:
BOTTOM ELECTRODE MECHANISM, SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/230728
Kind Code:
A1
Abstract:
This bottom electrode mechanism is used for plasma processing and has: a base portion to which high-frequency power is applied when the plasma processing is performed; a dielectric body portion disposed on the upper surface of the base portion; and an induction heating mechanism. The induction heating mechanism comprises: an induction heating element heated by an induced magnetic field; and a magnetic field generation portion provided inside the base portion and generating the induced magnetic field.

Inventors:
MATSUMOTO NAOKI (JP)
OHATA MITSUNORI (JP)
MASUYAMA MASATAKA (JP)
MIHARA NAOKI (JP)
Application Number:
PCT/JP2022/018219
Publication Date:
November 03, 2022
Filing Date:
April 19, 2022
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H02N13/00; C23C16/46; C23C16/505; H01L21/205; H01L21/3065; H01L21/683
Domestic Patent References:
WO2009011015A12009-01-22
WO2019171948A12019-09-12
Foreign References:
JP2018186179A2018-11-22
JP2010232476A2010-10-14
US20100059182A12010-03-11
JP2013185760A2013-09-19
JP2007335709A2007-12-27
JP2009238375A2009-10-15
JP2004221138A2004-08-05
US20120148760A12012-06-14
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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