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Patent Searching and Data


Title:
BRACKET FOR SECURING PARTS TO BE MOUNTED ON CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2012/014782
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a bracket for securing parts to be mounted on a circuit board, the bracket capable of being readily manufactured and achieving a good solderability and high resistance to whisker. The bracket has a soldered plate portion (11) which is secured by soldering to a surface of the circuit board (1) using cream solder; and a parts securing portion (12) which is secured to a connector to be mounted on the circuit board (1). Furthermore, an annular pierced groove (13) is formed so as to surround the central area of the soldered plate portion (11), with a bridge portion (16) left on part of the circumference. Then, an island portion (15) inside the pierced groove (13) is cut away from a peripheral portion (14) with the bridge portion (16) left. Furthermore, a step height (17) which is recessed relative to a soldered face (15B) of the island portion (15) is formed on a soldered face (11A) of the bridge portion (16); and then the soldered face (15B) of the island portion (15) is plated with pure Sn and the surface of the other portions is plated so as to provide resistance to whisker.

Inventors:
MURO Takashi (())
Application Number:
JP2011/066591
Publication Date:
February 02, 2012
Filing Date:
July 21, 2011
Export Citation:
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Assignee:
YAZAKI CORPORATION (4-28, Mita 1-chome Minato-k, Tokyo 33, 〒1088333, JP)
矢崎総業株式会社 (〒33 東京都港区三田1丁目4番28号 Tokyo, 〒1088333, JP)
International Classes:
H01R24/76; H01R13/73
Attorney, Agent or Firm:
HONDA Hironori et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims: