BRITTLE BOARD DIVIDING SYSTEM AND BRITTLE BOARD DIVIDING METHOD

Title:

BRITTLE BOARD DIVIDING SYSTEM AND BRITTLE BOARD DIVIDING METHOD

Document Type and Number:

WIPO Patent Application WO/2004/096721

Kind Code:

A1

Abstract:

A brittle board dividing system comprises a scribing device provided with a scribe line forming means for forming a scribe line on the first surface of a brittle board, and a breaking device for breaking the brittle board along the scribe line, the breaking device having a first press control means by which pressing against the second surface of the brittle board opposed to the first surface of the brittle board is moved along the scribe line while holding the first surface of the brittle board.

Inventors:

OTODA KENJI (JP)
INOUE SHUICHI (JP)

Application Number:

PCT/JP2004/006103

Publication Date:

November 11, 2004

Filing Date:

April 27, 2004

Export Citation:

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Assignee:

MITSUBOSHI DIAMOND IND CO LTD (JP)
OTODA KENJI (JP)
INOUE SHUICHI (JP)

International Classes:

B28D5/00; C03B33/027; C03B33/03; C03B33/033; C03B33/037; C03B33/09; G02F1/13; H01J9/24; G02F1/1333; (IPC1-7): C03B33/033; B28D5/00; B23K26/38

Domestic Patent References:

WO2002057192A1	2002-07-25
WO2002057192A1	2002-07-25

Foreign References:

JPS60112634A	1985-06-19
JPS5276317A	1977-06-27
JP2000063137A	2000-02-29
JPH11116260A	1999-04-27
JP2003286044A	2003-10-07
FR2304582A1	1976-10-15

Other References: