Title:
BRITTLE MATERIAL PROCESSING LIQUID
Document Type and Number:
WIPO Patent Application WO/2018/169008
Kind Code:
A1
Abstract:
The present invention relates to a brittle material processing liquid which contains water, (A) one or more substances selected from the group consisting of acetylene glycols having an HLB value of from 4 to 12 (inclusive) and alkylene oxide addition products of the acetylene glycols having an HLB value of from 4 to 12 (inclusive), and (B) a nonionic surfactant which is an ethylene oxide addition product having an HLB value of 6 or more and a number of moles of added ethylene oxide in the molecular structure of 5 or more, and which does not have an acetylene group, and wherein: the content of the component (A) is from 0.010% by mass to 0.200% by mass (inclusive) based on 100% by mass of the total of the brittle material processing liquid; the content of the component (B) is from 0.020% by mass to 0.500% by mass (inclusive) based on 100% by mass of the total of the brittle material processing liquid; and the content ratio of the component (A) to the component (B), namely (A)/(B) is from 0.05 to 2.00 (inclusive) in terms of mass ratio. The present invention also relates to a method for producing this brittle material processing liquid.
Inventors:
KITAMURA TOMOHIKO (JP)
Application Number:
PCT/JP2018/010249
Publication Date:
September 20, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C10M173/02; B24B27/06; B28D5/04; C10M129/08; C10M145/26; C10N20/00; C10N30/00; C10N30/18; C10N40/22; H01L21/304
Domestic Patent References:
WO2014162945A1 | 2014-10-09 | |||
WO2011058929A1 | 2011-05-19 |
Foreign References:
JP2003183548A | 2003-07-03 | |||
JP2002053788A | 2002-02-19 | |||
JP2012201750A | 2012-10-22 | |||
JP2014159529A | 2014-09-04 | |||
JP2014172950A | 2014-09-22 |
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (JP)
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