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Patent Searching and Data


Title:
BRITTLE SUBSTRATE CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/204055
Kind Code:
A1
Abstract:
A cutting edge (51) provided with a distal end section (51N) having axial symmetry in an axial direction (AX) is prepared. While orienting the axial direction (AX) of the cutting edge (51) so as to be perpendicular to one surface (SF1) of a brittle substrate (4), the distal end section (51N) of the cutting edge (51) is moved on the one surface (SF1) in a sliding manner, thereby forming a trench line in a crack-free state. A crack line is formed by extending a crack in the brittle substrate (4) along the trench line (TL) in a thickness direction (DT). The brittle substrate (4) is cut along the crack line.

Inventors:
SOYAMA Hiroshi (32-12, Koroen, Settsu cit, Osaka 34, 〒5660034, JP)
IMURA Atsushi (32-12, Koroen, Settsu cit, Osaka 34, 〒5660034, JP)
Application Number:
JP2017/018536
Publication Date:
November 30, 2017
Filing Date:
May 17, 2017
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (32-12, Koroen Settsu cit, Osaka 34, 〒5660034, JP)
International Classes:
B28D5/00; C03B33/027; C03B33/033; C03B33/037; H01L21/301
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (10th floor, Sumitomo-seimei OBP Plaza Bldg. 4-70, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 〒5400001, JP)
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