BRONZING-SURFACE-TREATED COPPER FOIL, PROCESS FOR PRODUCING THE SAME, AND ELECTROMAGNETIC WAVE SHIELDING CONDUCTIVE MESH FOR FRONT PANEL OF PLASMA DISPLAY UTILIZING THE BRONZING-SURFACE-TREATED COPPER FOIL

Title:

Document Type and Number:

WIPO Patent Application WO/2005/064044

Kind Code:

A1

Abstract:

A surface-treated copper foil that is free from powder fall, having a bronzing-treated layer of uniform color tone and that does not contain foreign metals becoming an etching inhibiting factor so as to attain further facilitation of etching operation. Thus, there is provided a bronzing-surface-treated copper foil being a copper foil having a bronzing-treated surface formed by copper plating performed in multiple stages, wherein the cross-sectional height of the bronzing-treated surface is 150 nm or less. This bronzing-treated surface is characterized by, for example, exhibiting an a-value in Lab color system of 4.0 or less. This surface-treated copper foil is produced fundamentally through a process comprising the steps of (a) fundamental plating operation, (b) additional plating operation, (c) coating plating operation, (d) finishing plating operation and (e) washing/drying operation.

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Inventors:

Higuchi, Tsutomu c/o MITSUI MINING & SMELTING CO. (LTD. Corporate R & D Center 1333-2, Haraich, Ageo-shi Saitama 21, 36200, JP)

Application Number:

PCT/JP2004/019006

Publication Date:

July 14, 2005

Filing Date:

December 20, 2004

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO.,LTD. (11-1, Osaki 1-chome Shinagawa-ku Tokyo, 84, 14185, JP)
Higuchi, Tsutomu c/o MITSUI MINING & SMELTING CO. (LTD. Corporate R & D Center 1333-2, Haraich, Ageo-shi Saitama 21, 36200, JP)

International Classes:

C25D5/10; C25D7/06; G09F9/00; H01J17/02; H05K9/00; H05K3/38; (IPC1-7): C25D7/06; C25D5/10; H01J17/02; H05K9/00

Attorney, Agent or Firm:

Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, 33008, JP)

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