Title:
BUCKLE FOR HEAT RADIATION FIN
Document Type and Number:
WIPO Patent Application WO/2016/090918
Kind Code:
A1
Abstract:
A buckle for a heat radiation fin. The buckle for a heat radiation fin comprises a support for buckling a chip. The support is provided with a support element for supporting the support and a fixing element for fixing a heat radiation fin. One end of the support element is connected to the support and the other end of the support element is inserted into a gap between the chip and a main board. The buckle for a heat radiation fin can solve the technical problems of assembly and disassembly inconvenience of the heat radiation fin and poor heat radiation effect caused when the heat radiation fin is bonded to the chip by using heat-conducting glue at present.
Inventors:
YU FANGXIANG (CN)
ZHANG XIANMING (CN)
JING HUANQIANG (CN)
ZHANG XIANMING (CN)
JING HUANQIANG (CN)
Application Number:
PCT/CN2015/084498
Publication Date:
June 16, 2016
Filing Date:
July 20, 2015
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H01L23/40; G06F1/20
Foreign References:
| CN2582047Y | 2003-10-22 | |||
| CN200953700Y | 2007-09-26 | |||
| CN2580384Y | 2003-10-15 | |||
| CN101083885A | 2007-12-05 | |||
| CN102056456A | 2011-05-11 |
Attorney, Agent or Firm:
KANGXIN PARTNERS, P. C. (CN)
北京康信知识产权代理有限责任公司 (CN)
北京康信知识产权代理有限责任公司 (CN)
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