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Title:
BUFFER MATERIAL FOR HOT PRESSING
Document Type and Number:
WIPO Patent Application WO/2017/175734
Kind Code:
A1
Abstract:
A buffer material for hot pressing according to an embodiment of the present invention comprises: at least one substrate layer having a fibrous layer which is composed of a woven fabric or a nonwoven fabric, and having a first polymeric antistatic agent which is present along the fiber surface of the fibrous layer; a second polymeric antistatic agent which is present as the outermost layer on one main surface of the substrate layer; and a third polymeric antistatic agent which is present as the outermost layer on the other main surface of the substrate layer.

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Inventors:
NAKANO SHIGERU (JP)
ITAKURA RYOHEI (JP)
Application Number:
PCT/JP2017/013991
Publication Date:
October 12, 2017
Filing Date:
April 03, 2017
Export Citation:
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Assignee:
KINYOSHA KK (JP)
International Classes:
B29C43/32
Foreign References:
JP2011116034A2011-06-16
JP2014087999A2014-05-15
JPS6237102A1987-02-18
JPH0524060A1993-02-02
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
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