Title:
BULK ACOUSTIC WAVE RESONATOR ASSEMBLY HAVING ACOUSTIC DECOUPLING LAYER, MANUFACTURING METHOD, FILTER, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/028402
Kind Code:
A1
Abstract:
The present disclosure relates to a bulk acoustic wave resonator assembly, which comprises: a substrate; at least two resonators, the at least two resonators being bulk acoustic wave resonators, and said resonators being stacked in a thickness direction of the substrate on a side of the substrate; the at least two resonators comprise a first resonator and a second resonator, the second resonator is above the first resonator, the first resonator has a first top electrode, a first piezoelectric layer, a first bottom electrode, and a first acoustic mirror, and the second resonator has a second top electrode, a second piezoelectric layer, a second bottom electrode, and a second acoustic mirror, wherein a hollow cavity-type acoustic decoupling layer is arranged between the first top electrode and the second bottom electrode, the acoustic decoupling layer serving as the second acoustic mirror. The present disclosure further relates to a manufacturing method for a bulk acoustic wave resonator assembly, a filter, and an electronic device.
Inventors:
PANG WEI (CN)
ZHANG WEI (CN)
ZHANG MENGLUN (CN)
ZHANG WEI (CN)
ZHANG MENGLUN (CN)
Application Number:
PCT/CN2021/110252
Publication Date:
February 10, 2022
Filing Date:
August 03, 2021
Export Citation:
Assignee:
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
International Classes:
H01P1/20; H03H9/02; H03H3/00; H03H9/05; H03H9/25
Foreign References:
| US20070176710A1 | 2007-08-02 | |||
| CN101009482A | 2007-08-01 | |||
| US20120218058A1 | 2012-08-30 | |||
| US20120218056A1 | 2012-08-30 | |||
| CN111193485A | 2020-05-22 | |||
| CN204481097U | 2015-07-15 |
Attorney, Agent or Firm:
BEIJING JINCHENG TONGDA & NEAL LAW FIRM (CN)
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