Title:
BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/154345
Kind Code:
A1
Abstract:
A bulk acoustic wave resonator and a manufacturing method therefor. The bulk acoustic wave resonator comprises: an air gap (305) outside an effective piezoelectric region (306), the air gap (305) being located between an upper electrode (304) and a piezoelectric layer (303) and/or between the piezoelectric layer (303) and a substrate (309), and the air gap (305) covering an end of a lower electrode (302) near the air gap (305) or the air gap (305) being connected to the end of the lower electrode (302), wherein the air gap (305) has a first end near the effective piezoelectric region (306), and at least a portion of an upper surface of the air gap (305) originating from the first end is a curved upper surface. The bulk acoustic wave resonator improves the Q value, the effective electromechanical coupling coefficient K2
t,eff, and the antistatic discharge capability of a device, and reduces stress in a device electrode, thereby improving the performance and reliability of the resonator.
Inventors:
PANG WEI (CN)
ZHANG MENGLUN (CN)
SUN CHEN (CN)
ZHANG MENGLUN (CN)
SUN CHEN (CN)
Application Number:
PCT/CN2019/074534
Publication Date:
August 15, 2019
Filing Date:
February 02, 2019
Export Citation:
Assignee:
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
International Classes:
H03H9/02
Foreign References:
| CN101908865A | 2010-12-08 | |||
| CN107140597A | 2017-09-08 | |||
| CN103532516A | 2014-01-22 | |||
| US20100033063A1 | 2010-02-11 |
Attorney, Agent or Firm:
DEHENG IP LAW, LLC (CN)
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