Title:
BURRLESS CASTELLATION VIA PROCESS AND PRODUCT FOR PLASTIC CHIP CARRIER
Document Type and Number:
WIPO Patent Application WO2000071921
Kind Code:
A3
Abstract:
This invention incorporates a new process and structure for manufacturing castellation via in plastic chip carrier. It allows the creation of uniform side wall contacts in the shape of half-cylinders, devoid of any burrs and power dust particles, which when present in a plastic chip carrier, would prevent reliable electrical contacts by causing either short or open circuits. Thus the invention enables plastic chip carrier as a practical way of replacing traditional ceramic chip carriers.
Inventors:
HUANG EDWARD
MA JONNY
CHEN SCOTT
WU PAUL
MA JONNY
CHEN SCOTT
WU PAUL
Application Number:
PCT/IB2000/000709
Publication Date:
August 09, 2001
Filing Date:
April 25, 2000
Export Citation:
Assignee:
UNICAP ELECTRONICS INC CORP (CN)
International Classes:
C25D7/12; H01L21/48; C25D5/02; H01L23/12; H01L23/498; H05K3/40; H05K3/00; H05K3/42; (IPC1-7): H01L23/12; H01L23/50
Foreign References:
| JPH0974151A | 1997-03-18 | |||
| JPS59125642A | 1984-07-20 | |||
| JPS6035545A | 1985-02-23 |
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