Title:
BUS BAR, CONNECTION STRUCTURE FOR BUS BAR AND CIRCUIT BOARD, AND METHOD FOR CONNECTING BUS BAR AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/090033
Kind Code:
A1
Abstract:
A connection structure (1) for a bus bar and a circuit board comprises: a circuit board (6); a bus bar body portion (11) including a base material of metal and a thin film of metal covering a surface of the base material; a first connection portion (13) provided to the bus bar body portion (11) and to which the circuit board (6) is connected; a recess (17) provided in the bus bar body portion (11) and having a surface (18) at least partly exposing the base material; and a solder (10) connecting the circuit board (6) to the first connection portion (13).
Inventors:
OSAKA RYOSUKE (JP)
Application Number:
PCT/JP2022/038857
Publication Date:
May 25, 2023
Filing Date:
October 19, 2022
Export Citation:
Assignee:
YAZAKI CORP (JP)
International Classes:
H05K1/02; H01R4/02; H01R4/58; H05K3/34; H05K7/06
Domestic Patent References:
| WO2011105095A1 | 2011-09-01 |
Foreign References:
| JP2018055843A | 2018-04-05 | |||
| JP2015139289A | 2015-07-30 | |||
| JP2021118154A | 2021-08-10 | |||
| JP2003115337A | 2003-04-18 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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