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Patent Searching and Data


Title:
BUS BAR HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/183971
Kind Code:
A1
Abstract:
This bus bar heat dissipation structure is provided with a bus bar, a coating member that is formed from a resin material and that coats the bus bar, and a housing that is formed from a metal material. The coating member has a contact part being in contact with the housing, and is integrally molded with the bus bar by inserting the bus bar therethrough.

Inventors:
SAKAI HIDEAKI (JP)
IWATA KUNIHIRO (JP)
KOBAYASHI KEN (JP)
Application Number:
PCT/JP2020/003578
Publication Date:
September 17, 2020
Filing Date:
January 31, 2020
Export Citation:
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Assignee:
TOYOTA TEKKO KK (JP)
International Classes:
H05K7/20; H01B7/42; H02G3/30
Foreign References:
JP2013070028A2013-04-18
Attorney, Agent or Firm:
FUJII Toshiya et al. (JP)
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