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Patent Searching and Data


Title:
BUSBAR, AND BUSBAR MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/142828
Kind Code:
A1
Abstract:
A busbar with excellent practicality and an aluminum substrate as the base material, and a manufacturing method of said busbar are provided. This busbar is provided with: an aluminum substrate; a metal film deposited on the aluminum substrate by cold spraying using a mixed powder material obtained by mixing a first powder material, which has as a component any of nickel (Ni), gold (Au), zinc (Zn), silver (Ag) and copper (Cu), or an alloy of two or more of these, and a second powder material, which has as a component tin (Sn) or an alloy containing Sn; a conductive material arranged on the metal film; and a screw for screwing and fixing the aluminum substrate and the metal film to the conductive material.

Inventors:
HIRANO MASAKI (JP)
Application Number:
PCT/JP2019/001111
Publication Date:
July 25, 2019
Filing Date:
January 16, 2019
Export Citation:
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Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C23C24/04; H01R4/38; H01R4/62; H01R13/03; H01R43/16
Foreign References:
JP2016216771A2016-12-22
JP2015065105A2015-04-09
JP2011233273A2011-11-17
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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