Title:
BUSING SUB-ASSEMBLY FOR PHOTOVOLTAIC MODULES
Document Type and Number:
WIPO Patent Application WO/2012/142249
Kind Code:
A3
Abstract:
Embodiments of the invention generally relate to a busing sub-assembly and methods of forming photovoltaic modules having busing sub-assemblies. The busing sub-assembly generally includes a carrier backsheet and a plurality of conductive ribbons coupled to the carrier backsheet. An electrically insulating cover is disposed over the conductive ribbons and the carrier backsheet. The ends of each conductive ribbon remain exposed for making an electrical connection to the conductive foil or a junction box. Methods of forming photovoltaic modules generally include positioning a flexible backsheet having an opening therethrough and a conductive foil thereon on a support. A busing sub-assembly is disposed on the flexible backsheet over the opening and in electrical contact with the conductive foil. The busing sub-assembly includes the components necessary to bus electrical current from a plurality of solar cells to a junction box, and can be applied to a photovoltaic module in a singe process step.
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Inventors:
TELLE JOHN (US)
MURPHY BRIAN J (US)
MEAKIN DAVID H (US)
MURPHY BRIAN J (US)
MEAKIN DAVID H (US)
Application Number:
PCT/US2012/033268
Publication Date:
November 29, 2012
Filing Date:
April 12, 2012
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
TELLE JOHN (US)
MURPHY BRIAN J (US)
MEAKIN DAVID H (US)
TELLE JOHN (US)
MURPHY BRIAN J (US)
MEAKIN DAVID H (US)
International Classes:
H01L31/042
Foreign References:
| US20100012172A1 | 2010-01-21 | |||
| US20080053701A1 | 2008-03-06 | |||
| US20070095384A1 | 2007-05-03 |
Attorney, Agent or Firm:
PATTERSON, B. Todd et al. (L.L.P.3040 Post Oak Blvd., Suite 150, Houston Texas, US)
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