Title:
CABLE BONDING PROTECTION FOR HEAD DIMENSIONAL STABILITY
Document Type and Number:
WIPO Patent Application WO/2023/040882
Kind Code:
A1
Abstract:
An apparatus (1000) includes a beam (1002), a chip (1004) coupled to the beam (1002), a cable (1006) coupled to the beam (1002) by a first material (1008) located at opposite edges of the cable (1006), and wire bonds (1010) extending from pads of the cable (1006) to pads of the chip (1004). An apparatus (1000) includes a beam (1002) and a chip (1004) coupled to the beam (1002). The chip (1004) includes an array of magnetic transducers for transducing data on a magnetic recording tape. The apparatus (1000) includes a cable (1006) coupled to the beam (1002) by a first material (1008) located at opposite edges of the cable (1006), wire bonds (1010) extending from pads of the cable (1006) to pads of the chip (1004), and a second material (1102) encapsulating ends of the wire bonds (1010) that are located adjacent the cable (1006). The second material (1102) does not contact the chip (1004).
Inventors:
LIANG JASON (US)
HAMIDI HOODIN (US)
BROWN DANIEL (US)
HAMIDI HOODIN (US)
BROWN DANIEL (US)
Application Number:
PCT/CN2022/118685
Publication Date:
March 23, 2023
Filing Date:
September 14, 2022
Export Citation:
Assignee:
IBM (US)
IBM CHINA CO LTD (CN)
IBM CHINA CO LTD (CN)
International Classes:
G11B5/40
Foreign References:
| US5465186A | 1995-11-07 | |||
| US6219202B1 | 2001-04-17 | |||
| US20020109944A1 | 2002-08-15 | |||
| CN1822099A | 2006-08-23 | |||
| CN1299128A | 2001-06-13 |
Attorney, Agent or Firm:
ZHONGZI LAW OFFICE (CN)
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