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Patent Searching and Data


Title:
CAMERA ASSEMBLY, ASSEMBLY METHOD THEREFOR, AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2020/062915
Kind Code:
A1
Abstract:
The present application provides a camera assembly and an assembly method therefor. The method comprises: plastically packaging a chip-type electronic component and an image sensor to form a target plastic package module, the target plastic package module comprising an active surface, and both the welded end of the chip-type electronic component and the welded end of the image sensor are exposed on the active surface; forming a redistribution layer (RDL), drilling the RDL to form a through hole, the RDL comprising a dielectric layer and a metal wiring located in the dielectric layer, and connecting metal wiring exposed on a first surface of the RDL to the welded ends on the active surface of the target plastic package module. The technical solution provided in the embodiments of the present application can achieve the electrical connection of the electronic components by means of the metal wiring in the RDL, so that the overall height of the camera module is lowered.

Inventors:
CAO XI (CN)
RAN KUN (CN)
QING XIANGYONG (CN)
Application Number:
PCT/CN2019/090232
Publication Date:
April 02, 2020
Filing Date:
June 06, 2019
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H04N5/225; H01L27/146
Foreign References:
CN109461746A2019-03-12
CN106206485A2016-12-07
CN101847664A2010-09-29
CN106449680A2017-02-22
CN108323034A2018-07-24
US20070187711A12007-08-16
CN201811155503A2018-09-30
Other References:
See also references of EP 3780104A4
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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