Title:
CAMERA BOARD MODULE, CAMERA UNIT, STRUCTURE FOR CONNECTING LENS BARREL PEDESTAL AND SENSOR BOARD IN CAMERA UNIT AND CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/188847
Kind Code:
A1
Abstract:
This camera board module comprises a first multilayer circuit board and a second multilayer circuit board which are positioned so as to face each other, and a first flexible cable which connects a GND of the first multilayer circuit board and a GND of the second multilayer circuit board. The first multilayer circuit board and the second multilayer circuit board each have a GND surface in a surface layer and/or an inner layer. An electrical component which is a source of radiated electromagnetic field noise and circuit wiring are positioned on surfaces of the first multilayer circuit board and the second multilayer circuit board which face each other.
Inventors:
HATANO TOSHINOBU
SAITO MAKOTO
NAKAMURA KEN
TAKESHITA KAZUFUMI
SAITO MAKOTO
NAKAMURA KEN
TAKESHITA KAZUFUMI
Application Number:
PCT/JP2019/012258
Publication Date:
October 03, 2019
Filing Date:
March 22, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K1/14; G02B7/02; G02B17/02; H04N5/225; H05K9/00
Foreign References:
| JPH08148878A | 1996-06-07 | |||
| JP2001275022A | 2001-10-05 | |||
| JPH0723267A | 1995-01-24 | |||
| JPH0966689A | 1997-03-11 | |||
| JP2001085815A | 2001-03-30 | |||
| JP2008028106A | 2008-02-07 |
Attorney, Agent or Firm:
YOSHIDA Masaaki (JP)
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