Title:
CAMERA AND MANUFACTURING METHOD THEREOF, AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2018/045751
Kind Code:
A1
Abstract:
A camera, at least comprising: an image sensor, a flexible printed circuit board (FPC), and a substrate: the FPC is mounted on the substrate, and a position of the FPC is hollowed out; the image sensor is fixed onto the substrate corresponding to the hollowed out position of the FPC; and the image sensor is connected to the FPC by means of a signal line. By means of hollowing out the FPC in a position corresponding to the image sensor and mounting same on the substrate, the image sensor being fixed onto the substrate corresponding to the hollowed out position of the FPC, the present solution can reduce the overall thickness of the camera by at least the height of one FPC (120 um).
Inventors:
HUANG QIUYUE (CN)
KANG NANBO (CN)
JIN LINFANG (CN)
KANG NANBO (CN)
JIN LINFANG (CN)
Application Number:
PCT/CN2017/080478
Publication Date:
March 15, 2018
Filing Date:
April 13, 2017
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H04N5/225
Foreign References:
| CN105578736A | 2016-05-11 | |||
| CN106550177A | 2017-03-29 | |||
| CN105915769A | 2016-08-31 | |||
| US20150029159A1 | 2015-01-29 |
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