Title:
CAMERA MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/132883
Kind Code:
A1
Abstract:
The present technique pertains to a camera module and an electronic device configured so as to be able to reduce the risk of breakage. An image-capturing element has a light-receiving surface for receiving light, and is flip-chip mounted on a base. A joining material is joined to the optical rear surface of the image-capturing element such that a gap is formed with a rear-surface-side member provided on the optical rear-surface side of the image-capturing element on the opposite side from the light-receiving surface. The present technique can be applied, for example, to a camera module for capturing images, etc.
Inventors:
MADA YUSUKE (JP)
Application Number:
PCT/JP2016/053009
Publication Date:
August 25, 2016
Filing Date:
February 02, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/14; G02B7/02; H04N5/225; H04N5/369
Foreign References:
| JP2005317564A | 2005-11-10 | |||
| JP2002299592A | 2002-10-11 | |||
| JP2005278092A | 2005-10-06 | |||
| JP2005064591A | 2005-03-10 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
Nishikawa 孝 (JP)
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